1. Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (ebook)
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (ebook)
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (ebook)

Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (ebook)

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File Types:pdf

Authors:Qingke Zhang (auth.)

Publishers:Springer-Verlag Berlin Heidelberg

File Size:7 Mb (7665256)

Pages(estimated):XV, 143[153]

Year:2016

Part Number: 9783662488218
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